DocumentCode
1877458
Title
Microwave characterization of low temperature cofired ceramic
Author
Pruna, P. ; Gardner, R.D. ; Hankey, D.L. ; Turvey, S.P.
Author_Institution
Transelco Div., Ferro Corp., Penn Yan, NY, USA
fYear
1998
fDate
15-18 Mar 1998
Firstpage
134
Lastpage
137
Abstract
The use of low temperature cofired ceramic (LTCC) materials for the manufacture of high performance microelectronic packages operating at very high frequencies has found widespread acceptance due to LTCC´s durability, compactness and manufacturability. Extensive effort has been devoted to the characterization of the electrical performance of the dielectric and associated conductor materials to determine and predict performance when constructing electronic packages that operate over a broad band of frequencies from DC through high speed digital to the microwave and millimeter bands. This effort has focused on several different areas, including the effect of operating frequency on the bulk dielectric properties of the ceramic and the electrical properties of associated thick film materials, particularly conductors. The interaction of these materials during processing, has been investigated, to determine the interdependence of these characteristics, so that both design rules and processing guidelines for particular package configurations (such as microstrip and stripline) and applications may be optimized. The Ferro A6-M ceramic, has demonstrated low dielectric constant and low dielectric loss at a wide range of frequencies, is compatible with low cost, high performance conductor materials, such as silver, and may also be used in mixed metal configurations with combinations of gold and silver conductors, in applications where such an approach is necessary. This paper reviews some of the results which have been determined in electrical characterizations such as these and proposes new electrical evaluations that may prove useful in the future
Keywords
ceramics; dielectric losses; integrated circuit packaging; microwave integrated circuits; microwave reflectometry; multichip modules; permittivity; substrates; time-domain reflectometry; DTA; Ferro A6-M ceramic; MM wave packaging; TDR; associated thick film materials; borosilicate glass ceramic; bulk dielectric properties; cavity resonance; compactness; design rules; durability; electrical performance; high performance microelectronic packages; insertion loss; low dielectric constant; low dielectric loss; low temperature cofired ceramic; manufacturability; microstrip; microwave characterization; mixed metal configuration; operating frequency effect; processing guidelines; stripline; very high frequencies; Ceramics; Conducting materials; Dielectric constant; Dielectric losses; Dielectric materials; Electronics packaging; Frequency; Manufacturing; Silver; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-7803-4795-1
Type
conf
DOI
10.1109/ISAPM.1998.664449
Filename
664449
Link To Document