• DocumentCode
    1877458
  • Title

    Microwave characterization of low temperature cofired ceramic

  • Author

    Pruna, P. ; Gardner, R.D. ; Hankey, D.L. ; Turvey, S.P.

  • Author_Institution
    Transelco Div., Ferro Corp., Penn Yan, NY, USA
  • fYear
    1998
  • fDate
    15-18 Mar 1998
  • Firstpage
    134
  • Lastpage
    137
  • Abstract
    The use of low temperature cofired ceramic (LTCC) materials for the manufacture of high performance microelectronic packages operating at very high frequencies has found widespread acceptance due to LTCC´s durability, compactness and manufacturability. Extensive effort has been devoted to the characterization of the electrical performance of the dielectric and associated conductor materials to determine and predict performance when constructing electronic packages that operate over a broad band of frequencies from DC through high speed digital to the microwave and millimeter bands. This effort has focused on several different areas, including the effect of operating frequency on the bulk dielectric properties of the ceramic and the electrical properties of associated thick film materials, particularly conductors. The interaction of these materials during processing, has been investigated, to determine the interdependence of these characteristics, so that both design rules and processing guidelines for particular package configurations (such as microstrip and stripline) and applications may be optimized. The Ferro A6-M ceramic, has demonstrated low dielectric constant and low dielectric loss at a wide range of frequencies, is compatible with low cost, high performance conductor materials, such as silver, and may also be used in mixed metal configurations with combinations of gold and silver conductors, in applications where such an approach is necessary. This paper reviews some of the results which have been determined in electrical characterizations such as these and proposes new electrical evaluations that may prove useful in the future
  • Keywords
    ceramics; dielectric losses; integrated circuit packaging; microwave integrated circuits; microwave reflectometry; multichip modules; permittivity; substrates; time-domain reflectometry; DTA; Ferro A6-M ceramic; MM wave packaging; TDR; associated thick film materials; borosilicate glass ceramic; bulk dielectric properties; cavity resonance; compactness; design rules; durability; electrical performance; high performance microelectronic packages; insertion loss; low dielectric constant; low dielectric loss; low temperature cofired ceramic; manufacturability; microstrip; microwave characterization; mixed metal configuration; operating frequency effect; processing guidelines; stripline; very high frequencies; Ceramics; Conducting materials; Dielectric constant; Dielectric losses; Dielectric materials; Electronics packaging; Frequency; Manufacturing; Silver; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-7803-4795-1
  • Type

    conf

  • DOI
    10.1109/ISAPM.1998.664449
  • Filename
    664449