Title :
Junction technology in SiC for high-voltage power devices
Author :
Kimoto, Tatsuya ; Kawahara, Kenji ; Niwa, Hiroki ; Okuda, Takafumi ; Suda, Jun
Author_Institution :
Dept. of Electron. Sci. & Eng., Kyoto Univ., Katsura, Japan
Abstract :
In electric power conversion systems of power infrastructures, electric vehicles, and power supplies, Si-based power semiconductor devices are employed as a key hardware. Reduction of power dissipation in the conversion systems is strongly required for energy saving. In particular, ultrahigh-voltage power converters with high efficiency are essential to realize a stable and highly efficient electric power network by optimizing the use of solar power and wind-generated power in the future. The efficiency of power converters/inverters strongly relies on the performance of power semiconductor devices employed in the power electronic systems. Silicon carbide (SiC) is a newly-emerging wide bandgap semiconductor, by which high-voltage, low-loss power devices can be realized owing to its superior properties [1-3]. The major features of SiC power devices include high-voltage blocking capability, low on-state resistance, fast switching speed, and high-temperature operation.
Keywords :
electric resistance; power convertors; power integrated circuits; power semiconductor devices; silicon compounds; wide band gap semiconductors; SiC; electric power network; energy saving; high-temperature operation; high-voltage blocking capability; low-loss power devices; on-state resistance; power dissipation reduction; power electronic systems; power inverters; power semiconductor devices; power supplies; solar power; switching speed; ultrahigh-voltage power converters; wide bandgap semiconductor; wind-generated power; Annealing; Ion implantation; Junctions; MOSFET; Silicon; Silicon carbide;
Conference_Titel :
Junction Technology (IWJT), 2013 13th International Workshop on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-0578-2
DOI :
10.1109/IWJT.2013.6644492