• DocumentCode
    1877548
  • Title

    Junction technology in SiC for high-voltage power devices

  • Author

    Kimoto, Tatsuya ; Kawahara, Kenji ; Niwa, Hiroki ; Okuda, Takafumi ; Suda, Jun

  • Author_Institution
    Dept. of Electron. Sci. & Eng., Kyoto Univ., Katsura, Japan
  • fYear
    2013
  • fDate
    6-7 June 2013
  • Firstpage
    54
  • Lastpage
    57
  • Abstract
    In electric power conversion systems of power infrastructures, electric vehicles, and power supplies, Si-based power semiconductor devices are employed as a key hardware. Reduction of power dissipation in the conversion systems is strongly required for energy saving. In particular, ultrahigh-voltage power converters with high efficiency are essential to realize a stable and highly efficient electric power network by optimizing the use of solar power and wind-generated power in the future. The efficiency of power converters/inverters strongly relies on the performance of power semiconductor devices employed in the power electronic systems. Silicon carbide (SiC) is a newly-emerging wide bandgap semiconductor, by which high-voltage, low-loss power devices can be realized owing to its superior properties [1-3]. The major features of SiC power devices include high-voltage blocking capability, low on-state resistance, fast switching speed, and high-temperature operation.
  • Keywords
    electric resistance; power convertors; power integrated circuits; power semiconductor devices; silicon compounds; wide band gap semiconductors; SiC; electric power network; energy saving; high-temperature operation; high-voltage blocking capability; low-loss power devices; on-state resistance; power dissipation reduction; power electronic systems; power inverters; power semiconductor devices; power supplies; solar power; switching speed; ultrahigh-voltage power converters; wide bandgap semiconductor; wind-generated power; Annealing; Ion implantation; Junctions; MOSFET; Silicon; Silicon carbide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology (IWJT), 2013 13th International Workshop on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4799-0578-2
  • Type

    conf

  • DOI
    10.1109/IWJT.2013.6644492
  • Filename
    6644492