Title :
1990 Proceedings. 40th Electronic Components and Technology Conference (Cat. No.90CH2893-6)
Abstract :
The following topics are dealt with: electronic packaging in the 90s; optical devices and reliability; ceramic and inorganic materials; hybrid microcircuits (substrates and applications); electrical modeling; optical component packaging; passive components; single chip packaging; soldered interconnections; advanced packaging; multichip modules; polyimides and organic materials; stresses in plastic; chip interconnections; active components; and encapsulation and molding materials
Keywords :
ceramics; electric connectors; encapsulation; integrated circuit technology; modules; optical elements; optoelectronic devices; packaging; polymers; reliability; semiconductor technology; substrates; active components; advanced packaging; ceramic materials; chip interconnections; electrical modeling; electronic components; electronic packaging; encapsulation; hybrid microcircuits; inorganic materials; molding materials; multichip modules; optical component packaging; optical devices; organic materials; passive components; polyimides; reliability; single chip packaging; soldered interconnections; stresses in plastic; substrates;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/ECTC.1990.122154
