DocumentCode :
1878265
Title :
Strain-induced I-V characteristics modulation of p-n junctions and MOS capacitors in Si CMOS devices
Author :
Yi Zhao ; Wangran Wu ; Jiabao Sun ; Yi Shi
Author_Institution :
Sch. of Electron. Sci. & Eng., Nanjing Univ., Nanjing, China
fYear :
2013
fDate :
6-7 June 2013
Firstpage :
94
Lastpage :
97
Abstract :
In this paper, we review the recent progresses about the effect of the uniaxial tensile strain on the electrical properties of the Si p-n junctions and MOS capacitors. We found that the uniaxial tensile stress could increase the junction current in the large-forward-bias region significantly. However, only a slight current increase has been observed in the diffusion-current-dominant region. In nMOSFETs the uniaxial tensile strain could enhance Isub significantly, while decreasing Ig slightly. Furthermore, in pMOSFETs, the uniaxial tensile strain could enhance both Ig and Isub. All these results have been explained by taking the strain induced subband structure modulation, current components variation and the piezoresistance effect into consideration.
Keywords :
CMOS integrated circuits; MOS capacitors; MOSFET; elemental semiconductors; internal stresses; p-n junctions; piezoresistance; silicon; MOS capacitors; Si; Si CMOS devices; diffusion-current-dominant region; electrical properties; junction current; large-forward-bias region; nMOSFET; p-n junctions; piezoresistance effect; strain-induced I-V characteristics modulation; uniaxial tensile strain; MOSFET; P-n junctions; Silicon; Strain; Tensile stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology (IWJT), 2013 13th International Workshop on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4799-0578-2
Type :
conf
DOI :
10.1109/IWJT.2013.6644514
Filename :
6644514
Link To Document :
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