3-Axes Flexible Tactile Sensor Fabricated by Si Micromachining and Packaging Technology

Author

Kim, K. ; Lee, K.R. ; Kim, Y.K. ; Lee, D.S. ; Cho, N.K. ; Kim, W.-H. ; Park, K.-B. ; Park, H.D. ; Park, Y.K. ; Kim, J.H. ; Pak, J.J.

Author_Institution

Nano Mechatronics Research Center, Korea Electronics Technology Institute, KOREA, Department of Electronics and Computer Engineering, Korea University, KOREA

fYear

2006

fDate

2006

Firstpage

678

Lastpage

681

Abstract

We present the fabrication process and characteristics of a 3-axes flexible tactile sensor available for normal and shear mode fabricated using Si micromachining and packaging technologies. The fabrication processes for the 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1%/N and 0.5%/N in applying normal and shear force, respectively. Because this tactile sensor can measure the variations of resistance of the semiconductor strain gauge for normal and shear force, it can be used to sense touch, pressure, hardness, and slip.

Keywords

Electrical resistance measurement; Fabrication; Force measurement; Force sensors; Micromachining; Pressure measurement; Semiconductor device packaging; Sensor phenomena and characterization; Strain measurement; Tactile sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on

Conference_Location

Istanbul, Turkey

ISSN

1084-6999

Print_ISBN

0-7803-9475-5

Type

conf

DOI

10.1109/MEMSYS.2006.1627890

Filename

1627890