Title :
Packaging induced stresses in a packaged micromechanical microphone
Author :
Rusanen, By Outi ; Torkkeli, Altti ; Vähäkangas, Jouko
Author_Institution :
VTT Electron., Espoo, Finland
Abstract :
The emergence of micromechanical components and systems offers a viable step towards miniaturisation of electronics products. VTT Electronics has developed a capacitive microphone that is manufactured using silicon micromachining. Die bonding to silicon substrate has shown to inflict only minor stresses to the microphone performance when an elastic silicone adhesive is used. Flip chip bonding will increase the amount of stresses, especially if the substrate material is not matched to silicon in its thermal expansion
Keywords :
adhesion; capacitors; flip-chip devices; internal stresses; membranes; microassembling; microphones; microsensors; semiconductor device packaging; thermal expansion; thermal stresses; Si; capacitive microphone; die bonding; elastic silicone adhesive; flip chip bonding; miniaturisation; packaged micromechanical microphone; packaging induced stresses; polysilicon membranes; silicon micromachining; thermal expansion; Bonding; Electronics packaging; Flip chip; Manufacturing; Microassembly; Micromachining; Micromechanical devices; Microphones; Silicon; Thermal stresses;
Conference_Titel :
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-4795-1
DOI :
10.1109/ISAPM.1998.664454
