Electronic packaging in the 90s-a perspective from Asia

An overview of the present status and future trends in electronic packaging technologies is presented. Advanced modules packaged with these technologies are show in three major systems: switching systems, transmission systems, and computer systems. It is projected that high-speed digital switching modules will adopt multichip packaging because they can transmit high-speed pulses. In the latter half of the 90s, prototypes of optical switching modules will be implemented. In optical communication systems, a fine flip-chip interconnection technique using solder bumps will become indispensable for high-speed optical modules operating at over 20 GHz. As inductance corresponding to wire length degrades electrical characteristics, innovative packaging using impedance-matched film carriers will be developed for GaAs MMIC (microwave monolithic integrated circuit) modules in future microwave transmission systems. Multichip packaging will be widely used in computer systems because it provides higher packaging density, ensuring reduced interconnection delays