• DocumentCode
    1879601
  • Title

    Mechanical and microstructural characteristics of dilute SnBi and SnBiIn alloys

  • Author

    Reinikainen, T. ; Kivalahti, J.K.

  • fYear
    1998
  • fDate
    15-18 Mar 1998
  • Firstpage
    170
  • Lastpage
    174
  • Abstract
    This paper presents extensive data on the mechanical properties of dilute SnBi alloys, where the Bi-content varies from 0.5 to 6 at%. The data are determined experimentally in the temperature range of -20 to +150°C using numerous different strain rates. The effect of In addition on the behavior of the SnBi3% and SnBi6% alloys is also investigated. Since it is obvious that the amounts of different phases-and not only the Sn-rich solid solution-change significantly during temperature cycling, notably in the SnBiIn alloys, thermodynamic assessments of the systems are also performed. The analyses which enable to evaluate the volume fractions of the phases in the alloys of fixed nominal compositions as a function of temperature indicated that there are considerable differences in the stabilities of the equilibrium structures of the solder joints at the peak cycling temperatures
  • Keywords
    alloying additions; bismuth alloys; creep; crystal microstructure; dilute alloys; dislocation climb; eutectic alloys; fine-pitch technology; grain boundary segregation; indium alloys; microassembling; precipitation; softening (metallurgical); soldering; stress-strain relations; tin alloys; -20 to 150 C; Sn-rich solid solution; SnBi; SnBiIn; creep; dilute solder alloys; dislocation climb; effect of In addition; equilibrium structures; eutectic alloy; fine pitch assembly; fluxless Pb-free microjoining; mechanical characteristics; microstructural characteristics; peak cycling temperatures; precipitation mechanisms; solder joints; strain softening; stress-strain curves; temperature cycling; thermodynamic assessment; transfusion bonding; varying Bi-content; volume fractions of phases; Assembly; Bismuth; Bonding; Grain boundaries; Microstructure; Soldering; Solids; Temperature distribution; Testing; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-7803-4795-1
  • Type

    conf

  • DOI
    10.1109/ISAPM.1998.664456
  • Filename
    664456