Electronic packaging in the 90s-a perspective from America

Author

Tummala, Rao R.

Author_Institution

IBM Corp., Hopewell Junction, NY, USA

fYear

1990

fDate

20-23 May 1990

Firstpage

9

Abstract

The advanced packaging technologies that can be expected in the 1990s in high-performance systems are discussed in terms of chip connection, power distribution, heat removal, and thick- and thin-film wiring and package interconnections. The following topics are discussed in detail: (1) chip-level connection providing the required connections between the chip and the package; (2) power distribution to the chip and heat removal from the chip; (3) first-level packages providing all the necessary wiring, interconnections, and power distribution; (4) first-to-second level interconnections; and (5) second-level packages providing all the necessary wiring, connections, power distribution, and power supply connection

Keywords

lead bonding; modules; packaging; tape automated bonding; technological forecasting; American perspective; advanced packaging technologies; chip connection; chip-level connection; first-level packages; first-to-second level interconnections; heat removal; high-performance systems; module wiring; package interconnections; power distribution; second-level packages; thick film wiring; thin-film wiring; Acceleration; Bonding; Electronics packaging; Integrated circuit interconnections; Material storage; Packaging machines; Power distribution; Semiconductor device packaging; Wiring; Workstations;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1990. ., 40th

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ECTC.1990.122161

Filename

122161