• DocumentCode
    1880045
  • Title

    Enhanced Local Void and Temperature Measurements for Highly Transient Two-Phase Flows

  • Author

    Schleicher, Eckhard ; Silva, Marco Jose Da ; Hampel, Uwe

  • Author_Institution
    Exp. Thermo fluid dynamics Div., Inst. of Safety Res., Dresden
  • fYear
    2006
  • fDate
    24-27 April 2006
  • Firstpage
    596
  • Lastpage
    599
  • Abstract
    We introduce a novel combined temperature and conductivity needle probe measuring system for local void fraction measurements in two-phase flow experiments. The system is able to deal with direct sheathed micro thermocouples as well as open thermocouples. It consists of a thermo needle probe connected to a special electronic circuit using AC measuring technique for the conductivity measurements and a high gain instrumentation amplifier with very high common mode rejection for the amplification of the Seebeck voltage generated by the micro thermocouple. After system build up and calibration, the system has been tested in different experiments. In a dropping experiment the time constant of the temperature measurement of the needle probe system was determined as 3.6 ms. Additionally, steam-water experiments have been carried out to demonstrate the system performance
  • Keywords
    Seebeck effect; electrical conductivity measurement; instrumentation amplifiers; temperature measurement; thermocouples; two-phase flow; AC measuring technique; Seebeck voltage; conductivity measurements; high gain instrumentation amplifier; local void fraction measurements; microthermocouples; needle probe measuring system; temperature measurements; thermo needle probe; two-phase flow experiments; AC generators; Conductivity measurement; Electronic circuits; Fluid flow measurement; Gain measurement; Instruments; Needles; Probes; Temperature measurement; Voltage; micro-thermocouple; needle probe; temperature measurement; two-phase flows;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference, 2006. IMTC 2006. Proceedings of the IEEE
  • Conference_Location
    Sorrento
  • ISSN
    1091-5281
  • Print_ISBN
    0-7803-9359-7
  • Electronic_ISBN
    1091-5281
  • Type

    conf

  • DOI
    10.1109/IMTC.2006.328630
  • Filename
    4124395