A Technique for Die Surface Temperature Measurement of High-Voltage Power Electronic Components using Coated Thermocouple Probes

Author

Salem, Thomas E. ; Ibitayo, Dimeji ; Geil, Bruce R.

Author_Institution

Dept. of Electr. Eng., United States Naval Acad., Annapolis, MD

fYear

2006

fDate

24-27 April 2006

Firstpage

651

Lastpage

654

Abstract

The performance capabilities of high-voltage high-power systems are significantly impacted by the thermal limitations of power electronic components. To address this issue, numerous current research efforts have been conducted to examine advanced packaging materials and structures as well as novel cooling techniques. Critical to the success of this work is the accurate measurement and characterization of the thermal characteristics of the power electronic components. This paper presents a methodology and assessment of using coated thermocouple probes for measuring the die surface temperature of active high-voltage power electronic components

Keywords

cooling; power semiconductor devices; semiconductor device measurement; semiconductor device testing; temperature measurement; thermal management (packaging); thermocouples; advanced packaging materials; coated thermocouple probes; cooling techniques; die surface temperature measurement; high-voltage power electronic components; thermal characteristics; thermal limitations; Coatings; Optical sensors; Power electronics; Probes; Temperature measurement; Temperature sensors; Thermal management; Thermal resistance; Thermal stresses; Voltage; high-voltage; temperature measurement; thermocouple probe;

fLanguage

English

Publisher

ieee

Conference_Titel

Instrumentation and Measurement Technology Conference, 2006. IMTC 2006. Proceedings of the IEEE

Conference_Location

Sorrento

ISSN

1091-5281

Print_ISBN

0-7803-9359-7

Electronic_ISBN

1091-5281

Type

conf

DOI

10.1109/IMTC.2006.328661

Filename

4124408