Integrated PCB active cooling with piezoelectric actuator

Thermal management is challenging in RF communication and radar systems that require high-power levels for operation and reliability as well as small footprints to control intrinsic losses and meet design constraints. An interesting approach uses discrete, in-situ fluid handling and embedded synthetic jet drivers to enhance local cooling at the component. In this approach, fluid cavities and actuators are integrated into the PCB near the component. Magnetic and piezoelectric actuators have proven effective in other less-demanding applications. The challenge to adapting from magnetic to piezoelectric actuators is to achieve high flowrates because piezo-actuators have lower displacement and higher frequencies. This investigation explores frequency and displacement effects on cooling rates for piezo-actuators embedded in PCB. Further concept development includes integration with thermal ground planes.