Title :
Thermal conductivity and specific heat determinations of a set of lead-free solder alloys
Author :
Kehoe, L. ; Crean, G.M.
Author_Institution :
Nat. Microelectron. Res. Centre, Cork, Ireland
Abstract :
With the elimination of lead-based solders from electronics manufacturing there is a need to understand the properties of their replacement alloys. In particular measurements of the thermal properties of the replacement alloys are critical for quality control as well as for reliability of the lead free solder joints. This paper will address the determination of the thermal diffusivity and heat capacity of a range of lead-free solder alloys based on Sn/Ag/Cu. Utilising the Laser Flash Technique and Differential Scanning Calorimetry the thermal conductivity will then be determined by a combination of these two properties and the alloy density. A comparison of the thermal conductivity determined from SnPb37 will be made
Keywords :
copper alloys; environmental factors; silver alloys; soldering; specific heat; thermal analysis; thermal conductivity; thermal diffusivity; tin alloys; Sn-Ag-Cu; density; differential scanning calorimetry; electronics manufacturing; laser flash technique; lead-free solder alloy; specific heat; thermal conductivity; thermal diffusivity; thermal properties; Calorimetry; Environmentally friendly manufacturing techniques; Equations; Laser theory; Lead; Pollution measurement; Slabs; Surface emitting lasers; Thermal conductivity; Time measurement;
Conference_Titel :
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-4795-1
DOI :
10.1109/ISAPM.1998.664460
