DocumentCode
1881037
Title
Challenges of Si photonics for on-chip integration
Author
Wada, K.
Author_Institution
Dept. of Mater. Eng., Univ. of Tokyo, Tokyo, Japan
fYear
2009
fDate
20-24 Sept. 2009
Firstpage
1
Lastpage
3
Abstract
To clear fundamental limits of electrical interconnection, WDM optical interconnection should be implemented in Si photonics. Challenging issues are strongly connected with temperatures in CMOS processing and in operation. We will report a solution of Ge backend processing and a proposal to avoid temperature fluctuation of light wavelengths.
Keywords
CMOS integrated circuits; elemental semiconductors; integrated optoelectronics; optical interconnections; p-i-n diodes; photodetectors; photodiodes; silicon; wavelength division multiplexing; CMOS; Ge; Si; WDM; backend processing; electrical interconnection; light wavelength temperature fluctuation; optical interconnection; photodetector; photodiode; photonics; pin diodes; wavelength division multiplexing; Annealing; CMOS process; Diodes; Fluctuations; Lattices; Photodetectors; Photodiodes; Photonics; Temperature; Wavelength division multiplexing;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Communication, 2009. ECOC '09. 35th European Conference on
Conference_Location
Vienna
Print_ISBN
978-1-4244-5096-1
Type
conf
Filename
5287023
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