Title :
Evaluation of metallization systems with test structures and yield modeling
Author :
DeLoach, C.A. ; Parks, H.G. ; Beck, S.E.
Author_Institution :
Brooktree Corp., San Diego, CA, USA
Abstract :
Comb test structures are used to evaluate three metal systems for IC use. Defects are analyzed based on density alone using a simple noncluster Poisson yield model and for clustering as well as using a negative binomial yield model. Results show that to accurately evaluate the highest yielding metal system at VLSI chip sizes, defects must be separated by type and evaluated in terms of clustering as well as defect density
Keywords :
VLSI; integrated circuit testing; metallisation; semiconductor process modelling; VLSI; chip sizes; comb test structures; defect density; metal systems; metallization systems; negative binomial yield model; noncluster Poisson yield model; test structures; yield modeling; Aluminum; Etching; FETs; Integrated circuit modeling; Integrated circuit yield; Metallization; Plasma applications; Plasma density; Semiconductor device modeling; System testing;
Conference_Titel :
Microelectronic Test Structures, 1993. ICMTS 1993. Proceedings of the 1993 International Conference on
Conference_Location :
Sitges
Print_ISBN :
0-7803-0857-3
DOI :
10.1109/ICMTS.1993.292891
