Title :
The use of test masks in the analysis of device yields
Author :
Rhodes, S.J. ; Day, G.C.
Author_Institution :
GEC Plessey Semicond. Ltd., Plymouth, UK
Abstract :
A product specific test mask is used to analyze circuit yield and associate it with device parameter yield, which can then more easily be related to process failure. Once a consistent failure mode has been identified, it is found that a problem specific test mask is also required to finally effect a solution. An example of this yield diagnosis methodology is described based on a nonvolatile static RAM (SRAM) circuit
Keywords :
SRAM chips; failure analysis; integrated circuit testing; masks; circuit yield; device yields; nonvolatile static RAM; process failure; test masks; yield diagnosis methodology; Circuit analysis; Circuit testing; Failure analysis; Information analysis; Integrated circuit interconnections; Low voltage; Manufacturing processes; Metallization; Production; Random access memory;
Conference_Titel :
Microelectronic Test Structures, 1993. ICMTS 1993. Proceedings of the 1993 International Conference on
Conference_Location :
Sitges
Print_ISBN :
0-7803-0857-3
DOI :
10.1109/ICMTS.1993.292920
