DocumentCode
1883681
Title
Advanced microelectronic packaging using BeO ceramics
Author
Sepulveda, Juan L.
Author_Institution
Brush Wellman Inc., Tucson, AZ, USA
fYear
1998
fDate
15-18 Mar 1998
Firstpage
287
Lastpage
293
Abstract
Beryllia ceramics have been successfully used during the last forty years to produce reliable packaging solutions for a wide range of commercial microelectronic packaging applications. Ceramic properties have been well defined and consistently controlled throughout production of many millions of circuits to insure high performance operation and product reliability
Keywords
beryllium compounds; ceramics; integrated circuit packaging; BeO; beryllia ceramic; microelectronic packaging; Ceramics; Copper; Electronic packaging thermal management; Electronics packaging; Gold; Metallization; Microelectronics; Substrates; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-7803-4795-1
Type
conf
DOI
10.1109/ISAPM.1998.664472
Filename
664472
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