Title :
New method of water cleaning for circuit substrates
Author :
Takayama, N. ; Sugiyama, T. ; Takahashi, K.
Author_Institution :
Shindengen Electr. Manuf. Co. Ltd., Saitama, Japan
Abstract :
Water-soluble flux which has characteristics equivalent to those of rosin flux has been developed by improving its activator and rheological modifier. Cleaning equipment has also been developed. The method was applied to cleaning on-board power-supply products, and the products passed a 1500-h temperature-humidity-bias test. It was demonstrated that combining the water-soluble flux and the cleaning equipment can provide the same reliability of reflow-soldered product as that of the product processed by the conventional cleaning method using rosin flux and solvent
Keywords :
environmental testing; hybrid integrated circuits; printed circuit manufacture; reliability; surface treatment; 1500 h; PCB manufacture; cleaning equipment; cleaning on-board power-supply products; environment protection; reflow-soldered product; reliability; temperature-humidity-bias test; water cleaning for circuit substrates; water-soluble flux; Assembly; Chemicals; Circuits; Cleaning; Electronics industry; Reflow soldering; Resins; Solvents; Testing; Water pollution;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122194