• DocumentCode
    1884099
  • Title

    High efficiency AlGaAs/GaAs power HBTs at a low supply voltage for digital cellular phones

  • Author

    Miura, T. ; Shimura, T. ; Mori, K. ; Uneme, Y. ; Nakano, H. ; Inoue, A. ; Hattori, R. ; Tanino, N.

  • Author_Institution
    Optoelectron. & Microwave Devices Lab., Mitsubishi Electr. Corp., Hyogo, Japan
  • fYear
    1996
  • fDate
    3-6 Nov. 1996
  • Firstpage
    91
  • Lastpage
    94
  • Abstract
    We present a high performance AlGaAs/GaAs power HBT with very low thermal resistance for digital cellular phones. Device structure with emitter air-bridge is utilized and device layout is optimized to reduce thermal resistance by three-dimensional thermal flow analysis, and in spite of a rather thick substrate (100 /spl mu/m), a low thermal resistance of 23/spl deg/C/W is achieved for a multi-finger (4/spl times/40 /spl mu/m/sup 2//spl times/40 fingers) HBT. This 40 finger HBT achieved power added efficiency (PAE) of over 53%, 29.1 dBm output power (Pout) and high associated gain (Ga) of 13.5 dB with 50 KHz adjacent channel leakage power (Padj) of less than 48 dBc under a 948 MHz /spl pi//4-shifted QPSK modulation with 3.4 V emitter-collector voltage.
  • Keywords
    III-V semiconductors; aluminium compounds; cellular radio; digital radio; gallium arsenide; heterojunction bipolar transistors; land mobile radio; power bipolar transistors; telephone sets; thermal resistance; /spl pi//4-shifted QPSK modulation; 13.5 dB; 3.4 V; 53 percent; AlGaAs-GaAs; AlGaAs/GaAs power HBT; adjacent channel leakage power; digital cellular phone; emitter air-bridge; gain; low voltage operation; multi-finger HBT; output power; power added efficiency; thermal resistance; three-dimensional thermal flow analysis; Assembly; Cellular phones; Electric resistance; Fabrication; Fingers; Gallium arsenide; Heterojunction bipolar transistors; Low voltage; Temperature; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1996. Technical Digest 1996., 18th Annual
  • Conference_Location
    Orlando, FL, USA
  • ISSN
    1064-7775
  • Print_ISBN
    0-7803-3504-X
  • Type

    conf

  • DOI
    10.1109/GAAS.1996.567746
  • Filename
    567746