Title :
A drive cycle based electro-thermal analysis of traction inverters
Author :
Haizhong Ye ; Kai Yang ; Hao Ge ; Magne, Pierre ; Emadi, Ali
Author_Institution :
McMaster Inst. for Automotive Res. & Technol. (MacAUTO), McMaster Univ., Hamilton, ON, Canada
Abstract :
This paper presents an electro-thermal simulation model to estimate the power devices junction temperatures of traction inverter. The model includes four sub-systems: hybrid electric vehicle simulation, model of traction motor, temperature dependent power loss model, and the thermal model of traction inverter. Firstly, load profile of the traction inverter is obtained considering the vehicle dynamic, the traction motor, and the drive cycle of the vehicle. Then, instantaneous power loss is calculated by using the load profile of the inverter. Based on the power loss and developed thermal models, junction temperatures of power devices are estimated. With the feedback of the junction temperatures into the power loss model, the temperature dependent power losses are obtained. Therefore, the electro-thermal simulation of traction inverter can be conducted. The electro-thermal model presented in this paper is simulated for the Urban Dynamometer Driving Schedule (UDDS) drive cycle, and the junction temperatures of power devices are obtained.
Keywords :
hybrid electric vehicles; invertors; traction motor drives; UDDS drive cycle; developed thermal model; drive cycle-based electro-thermal analysis; electrothermal simulation model; hybrid electric vehicle simulation; instantaneous power loss; inverter load profile; power device junction temperature; power loss; temperature-dependent power loss model; traction inverter load profile; traction motor; traction motor model; urban dynamometer driving schedule; vehicle drive cycle; vehicle dynamic; Insulated gate bipolar transistors; Inverters; Junctions; Load modeling; Multichip modules; Temperature dependence; Transient analysis;
Conference_Titel :
Transportation Electrification Conference and Expo (ITEC), 2014 IEEE
Conference_Location :
Dearborn, MI
DOI :
10.1109/ITEC.2014.6861761