DocumentCode
1884440
Title
Technology developments for terpene cleaning of electronic assemblies
Author
Tashjian, Gregory P. ; Wenger, George M.
Author_Institution
AT&T Network Syst., North Andover, MA, USA
fYear
1990
fDate
20-23 May 1990
Firstpage
253
Abstract
Following extensive process testing and machine development, a spray-cleaning facility utilizing the semiaqueous terpene hydrocarbon Bioact EC-7 was installed at AT&T´s Merrimack Valley manufacturing location in North Andover, MA. This facility, which represents a viable alternative to chlorofluorocarbon cleaning, is used to remove rosin-based-solder paste residues after reflow soldering of surface-mount devices to printed circuit (PC) board assemblies. The authors describe technology developments and operating experience gained during the implementation of semiaqueous terpene hydrocarbon cleaning. The EC-7 spray development/production machine will be used for further technology improvements in semiaqueous cleaning. The provisions incorporated in this machine, including the nitrogen inerting system, will enable the machine to handle almost any semiaqueous or aqueous material that may be developed
Keywords
organic compounds; printed circuit manufacture; surface treatment; AT&T; EC-7 spray development/production machine; Merrimack Valley manufacturing location; N2 inerting; PCB assemblies; alternative to chlorofluorocarbon cleaning; machine development; operating experience; process testing; reflow soldering; remove rosin-based-solder paste residues; semiaqueous terpene hydrocarbon Bioact EC-7; semiaqueous terpene hydrocarbon cleaning; spray-cleaning facility; surface-mount devices; technology developments; technology improvements; terpene cleaning of electronic assemblies; Assembly; Circuit testing; Cleaning; Hydrocarbons; Manufacturing processes; Nitrogen; Printed circuits; Production; Reflow soldering; Spraying;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ECTC.1990.122197
Filename
122197
Link To Document