• DocumentCode
    1884440
  • Title

    Technology developments for terpene cleaning of electronic assemblies

  • Author

    Tashjian, Gregory P. ; Wenger, George M.

  • Author_Institution
    AT&T Network Syst., North Andover, MA, USA
  • fYear
    1990
  • fDate
    20-23 May 1990
  • Firstpage
    253
  • Abstract
    Following extensive process testing and machine development, a spray-cleaning facility utilizing the semiaqueous terpene hydrocarbon Bioact EC-7 was installed at AT&T´s Merrimack Valley manufacturing location in North Andover, MA. This facility, which represents a viable alternative to chlorofluorocarbon cleaning, is used to remove rosin-based-solder paste residues after reflow soldering of surface-mount devices to printed circuit (PC) board assemblies. The authors describe technology developments and operating experience gained during the implementation of semiaqueous terpene hydrocarbon cleaning. The EC-7 spray development/production machine will be used for further technology improvements in semiaqueous cleaning. The provisions incorporated in this machine, including the nitrogen inerting system, will enable the machine to handle almost any semiaqueous or aqueous material that may be developed
  • Keywords
    organic compounds; printed circuit manufacture; surface treatment; AT&T; EC-7 spray development/production machine; Merrimack Valley manufacturing location; N2 inerting; PCB assemblies; alternative to chlorofluorocarbon cleaning; machine development; operating experience; process testing; reflow soldering; remove rosin-based-solder paste residues; semiaqueous terpene hydrocarbon Bioact EC-7; semiaqueous terpene hydrocarbon cleaning; spray-cleaning facility; surface-mount devices; technology developments; technology improvements; terpene cleaning of electronic assemblies; Assembly; Circuit testing; Cleaning; Hydrocarbons; Manufacturing processes; Nitrogen; Printed circuits; Production; Reflow soldering; Spraying;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1990. ., 40th
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ECTC.1990.122197
  • Filename
    122197