• DocumentCode
    1884590
  • Title

    Heat transport characteristics of capillary pumped loop with plate-type evaporator

  • Author

    Tsujimori, Atsushi ; Hirata, Kazufumi ; Nakaguchi, Kentaro ; Uchida, Maiko

  • Author_Institution
    Dept. of Mech. Eng., Kanto Gakuin Univ., Yokohama
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    12
  • Lastpage
    18
  • Abstract
    A tube-type evaporator requires capillary force in order to lift liquid refrigerant to circumference direction under a gravity field, which reduces thermal performance. Therefore, a capillary pumped loop with a plate-type evaporator was newly manufactured to improve the performance and reduce the thickness of the evaporator. The plate-type evaporator is flat disk shaped with an effective diameter of 46 mm. The wick with equivalent diameter of 5 mum and 2 mm thickness is embedded in it. The vapor line and liquid line are both 750 mm in length, and the condenser is 1000 mm in length. The condenser is soaked in a water bath set to a constant temperature by the refrigerator. The total heat transport length is 2500 mm. Using HFC134a as the working fluid, the heat transport characteristics were experimentally investigated by changing the heat load to the evaporator from 8 to 24.5 W. The plate-type evaporator achieved a higher evaporative heat transfer coefficient with higher heat flux into the evaporator than the tube-type evaporator.
  • Keywords
    evaporation; heat transfer; refrigerants; thermal management (packaging); HFC134a; capillary pumped loop; condenser; evaporative heat transfer coefficient; gravity field; heat flux; plate-type evaporator; refrigerator; working fluid; Electronics cooling; Gravity; Heat pumps; Heat sinks; Heat transfer; Refrigerants; Resistance heating; Temperature; Thermal force; Thermal resistance; capillary pumping; cooling device; evaporator; heat transfer; heat transport; thermal resistance; wick;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544247
  • Filename
    4544247