• DocumentCode
    1884592
  • Title

    300 mm fab design-a total factory perspective

  • Author

    Plata, John J.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1997
  • fDate
    6-8 Oct 1997
  • Abstract
    This paper identifies 300 mm issues that affect the design of the factory from the individual machine to the overall concept, and assess which factors have the greatest potential impact on the physical factory. The discrimination between the facility and the manufacturing equipment blurs: the melding of the equipment and the facility progresses to the point wherein the design of the facility is synergetic with the equipment and the wafer handling scheme. This suggests a scenario wherein the entire physical factory is considered as an integral part of the manufacturing “machine”. This paper details many of the potential issues and outlines the elements of an advanced production factory
  • Keywords
    clean rooms; factory automation; integrated circuit manufacture; materials handling; production control; 300 mm; advanced production factory; cleanroom design; manufacturing equipment; manufacturing facility; semiconductor wafer fab design; tool layout design; total factory perspective; wafer handling scheme; Cleaning; Computer integrated manufacturing; Costs; Ergonomics; Instruments; Logistics; Manufacturing automation; Materials handling; Production facilities; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-3752-2
  • Type

    conf

  • DOI
    10.1109/ISSM.1997.664481
  • Filename
    664481