Title :
Compatibility testing procedures and results for plastics and elastomers used with alternative cleaning agents
Author_Institution :
E.I. du Pont de Nemours & Co. Inc., Wilmington, DE, USA
Abstract :
Low-ozone-depleting cleaning agents are being developed to replace chlorofluorocarbon (CFC)-based solvents for electronics cleaning. In general, the alternative cleaning agents are chemically more aggressive than the conventional CFC-113 blends. Manufacturers of electronic components should therefore be concerned about the compatibility of the polymeric construction materials they choose to use in their parts. The author presents the compatibility testing procedures used by a cleaning-agent supplier to screen alternative candidates, and the effects of different types of alternative cleaning agents on various classes of plastics and elastomers. It is noted that the alternative cleaning agents are less forgiving toward various plastics and elastomers, especially the optical plastics (polycarbonate and acrylic) and the traditional sealing elastomers (Buna N, polychloroprene, and Viton A). Compatibility testing is easy to perform, and component manufacturers are encouraged to carry out similar tests to evaluate the potential impact of alternative cleaning agents on their particular products
Keywords :
elastomers; environmental testing; materials testing; plastics; polymers; printed circuit manufacture; surface treatment; Buna N; O3 layer protection; Viton A; acrylic; alternative cleaning agents; chemically aggressive cleaning agents; chemically more aggressive; cleaning-agent supplier; compatibility testing procedures; elastomers compatibility testing; electronics cleaning; low ozone depleting cleaning agents; optical plastics; plastics compatibility testing; polycarbonate; polychloroprene; screen alternative candidates; sealing elastomers; Building materials; Chemicals; Cleaning; Electronic components; Manufacturing; Optical devices; Plastics; Polymers; Solvents; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122198