Title :
F1: Silicon 3D-integration technology and systems
Author :
Urard, Pascal ; Takeuchi, Ken ; Bernstein, Kerry ; Hidaka, Hideto ; Phan, Michael ; Choi, Joo Sun ; Payne, Bob ; Stojanovic, Vladimir ; Berkel, Kees van ; Sakurai, Takayasu
Author_Institution :
STMicroelectronics, Crolles, France
Abstract :
This whole-day forum offers a complete overview of the existing and emerging 3D-techniques enabling higher interconnectivity between circuit components. It aims to show the advantages of these techniques such as reduced cost, lower power consumption and ease of integration of new generations of System-in-Package (SiP). Designers face different problems which are specific to the application segments such as imagers, battery operated devices, SSD, etc. This forum looks into these problems and presents different 3D-solutions.
Keywords :
Baseband; Batteries; CMOS technology; Cameras; Chip scale packaging; Circuit synthesis; Integrated circuit technology; Silicon; Stacking; Through-silicon vias;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2010 IEEE International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
978-1-4244-6033-5
DOI :
10.1109/ISSCC.2010.5433859
