DocumentCode
1884759
Title
Numerical and experimental investigations of boiling enhancement in buoyancy-driven microchannels
Author
Geisler, Karl J L ; Cohen, Avram Bar
Author_Institution
Gen. Dynamics Adv. Inf. Syst., Bloomington, MN
fYear
2008
fDate
28-31 May 2008
Firstpage
65
Lastpage
74
Abstract
In this study, confinement-driven boiling enhancement trends and experimental data from narrow parallel plate channels are presented and analyzed via comparison with numerical simulations of buoyancy-driven boiling and two phase flow using the commercially-available Fluent CFD software package. An Euler-Euler multiphase approach, known as the volume of fluid (VOF) method, is employed, as bubbles sizes are on the order of the channel dimensions. Numerical results suggest that enhanced natural convection already accounts for a large portion of the unconfined pool boiling heat flux. While the increased buoyancy from large vapor fractions in narrow channels may lead to an order of magnitude increase in channel mass flux, confinement-driven convective enhancement is found to increase the unconfined boiling heat flux by less than 10%. Further, simulated convective enhancement is found to be a maximum for intermediate size channels, in direct contrast to experimental data which show maximum enhancement (500%) for the smallest channels investigated. Experimental results for different channel wall materials suggest an enhancement mechanism highly dependent on boiling surface characteristics.
Keywords
boiling; bubbles; computational fluid dynamics; convection; flow simulation; microchannel flow; numerical analysis; two-phase flow; Fluent CFD software package; boiling enhancement; boiling surface characteristics; bubbles sizes; buoyancy-driven microchannels; channel mass flux; channel wall materials; confinement-driven convective enhancement; numerical simulations; parallel plate channels; two phase flow; unconfined pool boiling heat flux; volume of fluid method; Channel spacing; Heat sinks; Heat transfer; Microchannel; Numerical simulation; Rough surfaces; Surface roughness; Thermal conductivity; Thermal expansion; Thermal management; Bond number; VOF; bubble; confinement; heat transfer; multiphase;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location
Orlando, FL
ISSN
1087-9870
Print_ISBN
978-1-4244-1700-1
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2008.4544255
Filename
4544255
Link To Document