• DocumentCode
    1884759
  • Title

    Numerical and experimental investigations of boiling enhancement in buoyancy-driven microchannels

  • Author

    Geisler, Karl J L ; Cohen, Avram Bar

  • Author_Institution
    Gen. Dynamics Adv. Inf. Syst., Bloomington, MN
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    65
  • Lastpage
    74
  • Abstract
    In this study, confinement-driven boiling enhancement trends and experimental data from narrow parallel plate channels are presented and analyzed via comparison with numerical simulations of buoyancy-driven boiling and two phase flow using the commercially-available Fluent CFD software package. An Euler-Euler multiphase approach, known as the volume of fluid (VOF) method, is employed, as bubbles sizes are on the order of the channel dimensions. Numerical results suggest that enhanced natural convection already accounts for a large portion of the unconfined pool boiling heat flux. While the increased buoyancy from large vapor fractions in narrow channels may lead to an order of magnitude increase in channel mass flux, confinement-driven convective enhancement is found to increase the unconfined boiling heat flux by less than 10%. Further, simulated convective enhancement is found to be a maximum for intermediate size channels, in direct contrast to experimental data which show maximum enhancement (500%) for the smallest channels investigated. Experimental results for different channel wall materials suggest an enhancement mechanism highly dependent on boiling surface characteristics.
  • Keywords
    boiling; bubbles; computational fluid dynamics; convection; flow simulation; microchannel flow; numerical analysis; two-phase flow; Fluent CFD software package; boiling enhancement; boiling surface characteristics; bubbles sizes; buoyancy-driven microchannels; channel mass flux; channel wall materials; confinement-driven convective enhancement; numerical simulations; parallel plate channels; two phase flow; unconfined pool boiling heat flux; volume of fluid method; Channel spacing; Heat sinks; Heat transfer; Microchannel; Numerical simulation; Rough surfaces; Surface roughness; Thermal conductivity; Thermal expansion; Thermal management; Bond number; VOF; bubble; confinement; heat transfer; multiphase;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544255
  • Filename
    4544255