New technonomics trends and concepts of manufacturing for competitive deep-submicron ULSI and WSI

Author

Bubennikov, A.N. ; Bubennikov, A.A. ; Rakitin, V.V.

Author_Institution

Moscow Inst. of Phys. & Technol., Russia

fYear

1997

fDate

6-8 Oct 1997

Lastpage

12

Abstract

Technology and economics trends and concepts of advanced semiconductor manufacturing are considered. While DRAM and CMOS technologies are the work horses of modern VLSL in many application, the cost of dramatic process changes may not be justified by the benefits. Breakthrough bipolar-CMOS technologies, circuits and architectures offer potential advantages over simple scaling of CMOS. The key to a successful strategy of competitive deep-submicron ULSI, 2D-, 3D-WSI fabrication as complete systems is flexibility and performance. Research effort and breakthroughs are needed to explore more competitive developments for ULSI, 2D-, 3D-WSI manufacturing on Earth and in Space. Linking between flexible megafabs, pilot minifabs and Spacefabs will have to be planned for improved performance and reduced cycle time and cost of competitive advanced products

Keywords

ULSI; economics; integrated circuit manufacture; wafer-scale integration; 2D-WSI fabrication; 3D-WSI fabrication; IC manufacture; Spacefabs; advanced semiconductor manufacturing; cycle time reduction; deep-submicron ULSI; deep-submicron WSI; economics trends; flexible megafabs; pilot minifabs; technology trends; technonomics trends; CMOS process; CMOS technology; Circuits; Costs; Fabrication; Horses; Manufacturing; Random access memory; Semiconductor device manufacture; Ultra large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-3752-2

Type

conf

DOI

10.1109/ISSM.1997.664482

Filename

664482