Title :
Two phase cooling with heat transfer enhancement for BGA package
Author :
Khan, Navas ; Toh, K.C. ; Pinjala ; Kripesh, V. ; Yoon, Seung Wook
Author_Institution :
Inst. of Microelectron., Singapore
Abstract :
Boiling heat transfer enhancement for a two-phase cooling design is presented in this paper. The paper discusses an effective method of boiling heat transfer enhancement and its performance. The pool boiling heat transfer from the silicon surface is enhanced by combination of surface modification and micro machined structure. The effect of micro structure features like pore diameter, pore pitch, channel width, channel pitch on heat transfer enahcement has been investigated. Maximum of 300% higher heat flux is demonstrated with the enhancement structure. A compact two phase cooling solution for a BGA flip-chip package is developed and characterized. The enhancement structure is integrated with the two-phase cooling solution and its performance is reported.
Keywords :
ball grid arrays; boiling; flip-chip devices; heat transfer; thermal management (packaging); ball grid array flip-chip package; boiling heat transfer enhancement; heat flux; micro machined structure; pool boiling heat transfer; silicon surface; two-phase cooling design; Cooling; Heat sinks; Heat transfer; Microelectronics; Packaging machines; Silicon; Space heating; Temperature measurement; Thermal management; Transistors; Boiling heat transfer; Critical heat flux; Passive cooling; Pool boiling enhancement;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-1700-1
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2008.4544257
