Title :
Thermal characterisation of cots electronic boards
Author :
Monier-Vinard, E. ; Deu, J.M. ; Bissuel, V.
Author_Institution :
THALES Res. & Technol. France, Orsay
Abstract :
This paper establish a solution for detecting these components, establishing their model, that of the board which receives them. The checking analysis was conducted on a test board to create an adjusted thermal model by using a set of infrared measurements and an electrical measurement. Its response was then verified for conventional conditions of cooling. It is this validation presented as a comparison between simulation and experimentation that forms the subject of this document.
Keywords :
infrared imaging; military equipment; printed circuit testing; checking analysis; commercial off-the-shelf; electrical measurement; electronic boards; infrared measurements; thermal characterisation; thermal model; Computer aided software engineering; Cooling; Copper; Diodes; Electric variables measurement; Geometry; Solid modeling; Stress; Testing; Thermal conductivity;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-1700-1
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2008.4544264
