Title :
Development of a high-accuracy thermal interface material tester
Author :
Kempers, R. ; Kolodner, P. ; Lyons, A. ; Robinson, A.J.
Author_Institution :
Dept. of Mech. & Manuf. Eng., Trinity Coll. Dublin, Dublin
Abstract :
An experimental apparatus has been designed and constructed to accurately measure the next generation of high-performance thermal interface materials with unprecedented precision and accuracy. The apparatus is based on a common implementation of ASTM D5470 using meter bars. However, the apparatus in the present study is unique in that it utilizes small thermistors to make precise thermal measurements (plusmn0.003 K). These measurements are used to calculate the thermal impedance at the interface of two conducting bodies while keeping input power at a minimum. Furthermore, a robust and conservative uncertainty analysis is employed to calculate how the measured uncertainties contribute to the calculated quantities of thermal impedance and effective thermal conductivity. Baseline tests are performed to demonstrate the sensitivity and uncertainty of the apparatus by measuring the contact resistance of the meter bars in contact with each other as a representative low-thermal- impedance case. A contact thermal impedance as low as 2.81E-5 m2ldrK/W was measured with a calculated absolute uncertainty of approximately 2%. The effective thermal conductivity of a gap pad was also measured to further validate the apparatus.
Keywords :
contact resistance; thermal conductivity; thermistors; ASTM D5470; contact resistance; high-accuracy thermal interface material tester; high-performance thermal interface materials; thermal conductivity; thermal impedance; thermistors; uncertainty analysis; Bars; Conductivity measurement; Conductors; Electrical resistance measurement; Impedance measurement; Materials testing; Power measurement; Robustness; Thermal conductivity; Thermistors; thermal conductivity measurement; thermal contact resistance; thermal impedance; thermal interface material tester;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-1700-1
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2008.4544274