DocumentCode :
1885306
Title :
The evolution of water cooling for IBM large server systems: Back to the future
Author :
Ellsworth, Michael J. ; Campbell, L.A. ; Simons, R.E. ; Iyengar, R.R.S.
Author_Institution :
Schmidt, R.C. Chu, IBM Corp., Poughkeepsie, NY
fYear :
2008
fDate :
28-31 May 2008
Firstpage :
266
Lastpage :
274
Abstract :
This paper provides a technical perspective and review of water cooling technology as implemented through 5 generations of IBM´s high performance computing systems from the S360/91 to the recently announced IBM Power 575 supercomputing system. The use of hybrid air-to-water cooling and then indirect (cold plate) water cooling in earlier IBM systems is described. Attention is given to how and why water-cooling was implemented to provide the required cooling capability while maintaining ease of serviceability at the module level. Also discussed is the use of a Cooling Distribution Unit (CDU) to control cooling system water temperature, distribute water to multiple racks and serve as a buffer between system water and customer facility water. Rising microprocessor power dissipation, increased heat loads at the data center level, and demands for increased cooling energy efficiency are presented as driving the need for the reintroduction of water cooling. The introduction of the rear door heat exchanger to respond to the challenge of rising heat loads at the data center level is discussed. Finally, the IBM Power 575 water cooling system is described. Included in the discussion are the coolant flow architecture and the incorporation of Modular Water cooling Units (MWU´s) within the server frame replacing the remote CDU concept.
Keywords :
cooling; microprocessor chips; temperature control; IBM large server system; cooling distribution unit; cooling energy efficiency; cooling system water temperature control; data center level; heat load; microprocessor power dissipation; Cold plates; Control systems; Cooling; High performance computing; Microprocessors; Power dissipation; Power generation; Temperature control; Temperature distribution; Water heating; cold plate; coolant distribution unit; liquid cooling; modular water cooling unit; rear door heat exchanger; server; supercomputer;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Print_ISBN :
978-1-4244-1700-1
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2008.4544279
Filename :
4544279
Link To Document :
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