• DocumentCode
    188594
  • Title

    Transient electro-thermal analysis for a MOSFET based traction inverter

  • Author

    Kai Yang ; Jing Guo ; Hao Ge ; Bilgin, Berker ; Loukanov, Voiko ; Emadi, Ali

  • Author_Institution
    McMaster Automotive Resource Center, McMaster Univ., Hamilton, ON, Canada
  • fYear
    2014
  • fDate
    15-18 June 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this paper, an approach to evaluate the instantaneous junction temperature of MOSFET modules used in a high-power three-phase inverter is introduced. A Cauer resistor-capacitor model for the whole system is presented which is based on the MOSFET foster network model. In addition, a thermal impedance matrix of an air-forced cooling heat sink is developed by transient thermal analysis using computational fluid dynamics (CFD). Temperature dependence of power losses has been analyzed and a dynamic electro-thermal simulation considering the thermal coupling effect between different phases under real motor operating conditions is performed. Then, the wide time scale separation of the thermal time constants and transient temperature fluctuation caused by the small heat capacity of the chips are discussed. The thermal performance of the inverter under stall torque condition is also analyzed. The proposed approach is an effective tool for the reliability analysis and thermal management system design in traction inverters.
  • Keywords
    MOSFET circuits; RC circuits; circuit reliability; computational fluid dynamics; heat sinks; invertors; thermal analysis; traction motors; transient analysis; CFD analysis; Cauer resistor-capacitor model; MOSFET based traction inverter; MOSFET foster network model; air-forced cooling heat sink; computational fluid dynamics; high-power three-phase inverter; instantaneous junction temperature; reliability analysis; small heat capacity chips; stall torque condition; thermal coupling effect; thermal impedance matrix; thermal management system; thermal time constants; transient electro-thermal analysis; transient temperature fluctuation; Heat sinks; Impedance; Inverters; Junctions; MOSFET; Semiconductor device modeling; Thermal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transportation Electrification Conference and Expo (ITEC), 2014 IEEE
  • Conference_Location
    Dearborn, MI
  • Type

    conf

  • DOI
    10.1109/ITEC.2014.6861847
  • Filename
    6861847