• DocumentCode
    1886021
  • Title

    Scroll heat sink: A heat sink with the moving fins inserted between the cooling fins

  • Author

    Kim, Tae Young ; Kim, Dong Kwon ; Kim, Sung Jin

  • Author_Institution
    Sch. of Mech., Korea Adv. Inst. of Sci. & Technol., Daejeon
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    489
  • Lastpage
    496
  • Abstract
    In this paper, a novel heat sink with moving fins inserted between cooling fins is suggested for electronics cooling applications. In the novel heat sink, instead of the fan module, moving fins are inserted in the intervals of fixed fins (cooling fins) for generating fluid flow. By the relative motion of the moving fins to the cooling fins, heat dissipation from the cooling fins to the coolant and discharge of the heated coolant occur simultaneously. In the present study, experimental investigation is performed in order to demonstrate the proposed concept of the heat sink. In the experimental study, the average fluid velocities and the thermal resistances are measured for various rotating speeds from 200 RPM to 500 RPM. Experimental results show that measured flow rates of the coolant are almost linearly proportional to the rotating speed of the moving fins. Finally, the thermal performance of the scroll heat sink is compared to that of an equivalent plate-fin heat sink under the same Reynolds number. The scroll heat sink has at least 14% lower thermal resistance than that of the equivalent plate-fin heat sink in the range 0.135 m/s < V <0.56 m/s.
  • Keywords
    blades; cooling; heat sinks; power electronics; thermal management (packaging); Reynolds number; cooling fins; electronics cooling; fan module; fluid flow; heat dissipation; heat sink; thermal resistances; Coolants; Electrical resistance measurement; Electronics cooling; Fluid flow; Fluid flow measurement; Heat sinks; Resistance heating; Rotation measurement; Thermal resistance; Velocity measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544309
  • Filename
    4544309