DocumentCode
1886021
Title
Scroll heat sink: A heat sink with the moving fins inserted between the cooling fins
Author
Kim, Tae Young ; Kim, Dong Kwon ; Kim, Sung Jin
Author_Institution
Sch. of Mech., Korea Adv. Inst. of Sci. & Technol., Daejeon
fYear
2008
fDate
28-31 May 2008
Firstpage
489
Lastpage
496
Abstract
In this paper, a novel heat sink with moving fins inserted between cooling fins is suggested for electronics cooling applications. In the novel heat sink, instead of the fan module, moving fins are inserted in the intervals of fixed fins (cooling fins) for generating fluid flow. By the relative motion of the moving fins to the cooling fins, heat dissipation from the cooling fins to the coolant and discharge of the heated coolant occur simultaneously. In the present study, experimental investigation is performed in order to demonstrate the proposed concept of the heat sink. In the experimental study, the average fluid velocities and the thermal resistances are measured for various rotating speeds from 200 RPM to 500 RPM. Experimental results show that measured flow rates of the coolant are almost linearly proportional to the rotating speed of the moving fins. Finally, the thermal performance of the scroll heat sink is compared to that of an equivalent plate-fin heat sink under the same Reynolds number. The scroll heat sink has at least 14% lower thermal resistance than that of the equivalent plate-fin heat sink in the range 0.135 m/s < V <0.56 m/s.
Keywords
blades; cooling; heat sinks; power electronics; thermal management (packaging); Reynolds number; cooling fins; electronics cooling; fan module; fluid flow; heat dissipation; heat sink; thermal resistances; Coolants; Electrical resistance measurement; Electronics cooling; Fluid flow; Fluid flow measurement; Heat sinks; Resistance heating; Rotation measurement; Thermal resistance; Velocity measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location
Orlando, FL
ISSN
1087-9870
Print_ISBN
978-1-4244-1700-1
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2008.4544309
Filename
4544309
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