Constitutive relations of indium solder joint in cold temperature electronic packaging based on Anand model

Low temperature rate dependent deformation behavior of pure indium (In) was studied in this paper since the advantage of indium for cryogenic joining has been acknowledged for many years and the highly demanded simulation of its behavior in low temperature packaging applications. A rate-temperature dependent constitutive model, the Anand model, was successfully applied to represent the inelastic deformation behavior of indium at low temperatures down to -150degC. In order to determine the acquired data for the fitting of the material parameters in Anand model, a series of constant compressive load tests were conducted under isothermal conditions at different temperatures ranged from -150degC to 0degC. Model simulations and verifications revealed that the Anand model can be applied for representing the inelastic deformation behavior of indium solders from as low as -150degC to a high of 140degC.