• DocumentCode
    1887085
  • Title

    Finite element models for simulation of wear in electrical contacts

  • Author

    Lall, Pradeep ; Shinde, Darshan ; Rickett, Brett ; Suhling, Jeff

  • Author_Institution
    Dept of Mech. Eng., Auburn Univ., Auburn, AL
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    836
  • Lastpage
    841
  • Abstract
    Electrical contacts may be subjected to wear because of shock, vibration, and thermo-mechanical stresses resulting in fretting, increase in contact resistance, and eventual failure over the lifetime of the product. Previously, models have been constructed for various applications to simulate wear for dry unidirectional-sliding wear of a square-pin [1], unidirectional sliding of pin on disk [2], and wear mechanism maps for steel- on-steel contacts [3]. In this paper, a wear simulation model for fretting of reciprocating curved spring-loaded contacts has been proposed, based on instantaneous estimation of wear rate, which is time-integrated over a larger number of cycles, with continual update of the contact geometry during the simulation process. Arbitrary Lagrangian-Eulerian adaptive meshing has been used to simulate the wear phenomena. Model predictions of wear have been compared to experimental data plots, available from existing literature, to validate both, the 2D and 3D models. A large number of wear cycles have been simulated for common contact geometries, and the wear accrued computed in conjunction with the wear surface updates. The presented analysis is applicable to wide variety of contact systems found in consumer and defense applications including, RAM memory-card sockets, SD-card sockets, microprocessor, ZIF sockets, and fuzz button contacts.
  • Keywords
    electrical contacts; finite element analysis; Lagrangian-Eulerian adaptive meshing; RAM memory-card socket; contact system; electrical contact; finite element model; model prediction; spring-loaded contact; wear rate estimation; wear simulation model; wear surface update; Computational modeling; Contact resistance; Electric shock; Finite element methods; Geometry; Predictive models; Sockets; Solid modeling; Thermal stresses; Thermomechanical processes; Contact Resistance; Electrical Contacts; Finite-Element Models; Fretting; Reliability; Wear;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544353
  • Filename
    4544353