DocumentCode
1887085
Title
Finite element models for simulation of wear in electrical contacts
Author
Lall, Pradeep ; Shinde, Darshan ; Rickett, Brett ; Suhling, Jeff
Author_Institution
Dept of Mech. Eng., Auburn Univ., Auburn, AL
fYear
2008
fDate
28-31 May 2008
Firstpage
836
Lastpage
841
Abstract
Electrical contacts may be subjected to wear because of shock, vibration, and thermo-mechanical stresses resulting in fretting, increase in contact resistance, and eventual failure over the lifetime of the product. Previously, models have been constructed for various applications to simulate wear for dry unidirectional-sliding wear of a square-pin [1], unidirectional sliding of pin on disk [2], and wear mechanism maps for steel- on-steel contacts [3]. In this paper, a wear simulation model for fretting of reciprocating curved spring-loaded contacts has been proposed, based on instantaneous estimation of wear rate, which is time-integrated over a larger number of cycles, with continual update of the contact geometry during the simulation process. Arbitrary Lagrangian-Eulerian adaptive meshing has been used to simulate the wear phenomena. Model predictions of wear have been compared to experimental data plots, available from existing literature, to validate both, the 2D and 3D models. A large number of wear cycles have been simulated for common contact geometries, and the wear accrued computed in conjunction with the wear surface updates. The presented analysis is applicable to wide variety of contact systems found in consumer and defense applications including, RAM memory-card sockets, SD-card sockets, microprocessor, ZIF sockets, and fuzz button contacts.
Keywords
electrical contacts; finite element analysis; Lagrangian-Eulerian adaptive meshing; RAM memory-card socket; contact system; electrical contact; finite element model; model prediction; spring-loaded contact; wear rate estimation; wear simulation model; wear surface update; Computational modeling; Contact resistance; Electric shock; Finite element methods; Geometry; Predictive models; Sockets; Solid modeling; Thermal stresses; Thermomechanical processes; Contact Resistance; Electrical Contacts; Finite-Element Models; Fretting; Reliability; Wear;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location
Orlando, FL
ISSN
1087-9870
Print_ISBN
978-1-4244-1700-1
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2008.4544353
Filename
4544353
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