• DocumentCode
    1887086
  • Title

    Fatigue Life Evaluation of Subsea Wellhead Connector Based on Finite Element Method

  • Author

    Wang Chuan ; Hongwu Zhu ; Yinxun Zhang ; Kuang Ding ; Penghui Li

  • Author_Institution
    China Univ. of Pet., Beijing, China
  • fYear
    2013
  • fDate
    16-17 Jan. 2013
  • Firstpage
    562
  • Lastpage
    565
  • Abstract
    Drilling and work over operations offshore impose fatigue loads on the connector of sub sea wellhead stack due to the riser dynamics. In particular, the connector between them may be subjected to fatigue damage. The fatigue evaluation methodology of sub sea wellhead connectors requires a holistic analysis of the wellhead stack. In this paper, an evaluation methodology including finite element (FE) models, boundary conditions (BC) and stress transfer functions (STFs) for the analysis of wellhead assemblies and their interactions is described. Meanwhile linear and nonlinear models are used for calculating the stress level and STFs. The convergence of model and main results are discussed and analyzed to determine the hotspot. As the fatigue life is based on the local stresses and fatigue resistance is defined by S-N curves, the fatigue life of critical hotspot is evaluated based on the results of FE-analysis.
  • Keywords
    drilling (geotechnical); fatigue; finite element analysis; offshore installations; production equipment; reliability; BC; FE model; STF; boundary condition; drilling operation; fatigue damage; fatigue evaluation methodology; fatigue life evaluation; fatigue load; fatigue resistance; finite element method; offshore operation; riser dynamics; stress transfer function; subsea wellhead connector; wellhead stack; workover operation; Analytical models; Connectors; Contacts; Fasteners; Fatigue; Load modeling; Stress; Fatigue Life; Finite element; Hot Spots; Stress transfer functions; Subsea Wellhead Connector;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Measuring Technology and Mechatronics Automation (ICMTMA), 2013 Fifth International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4673-5652-7
  • Type

    conf

  • DOI
    10.1109/ICMTMA.2013.140
  • Filename
    6493792