Influence of fastening methods on the dynamic response and reliability assessment of PCBS in cellular phones under free drop

In this work, free drop impact responses of printed circuit boards (PCBs) mounted in cellular phones has been investigated to assess their dynamic responses and investigate the effects of fastening methods. The digital image correction (DIC) method was used in order to measure a full-field deformation of PCBs during drop from a certain height. Three different fastening techniques which have point or edge contact between the PCBs and the casings were considered. Along with the drop impact experiments, the impact response analysis using ANSYS/LS-DYNA has been performed. To validate the numerical model, the impact response has been compared with the experimental one extracted from the DIC of the PCB. The deformations of the numerical model are well matched with the experimental ones. The effects of assembly method are investigated to assess reliability of PCBs.