Development of a package utilizing an electromagnetic coupling structure

Author

Koriyama, S. ; Kitazawa, K. ; Fujii, M.

Author_Institution

R&D Center, Kyocera Corp., Kagoshima,, Japan

Volume

2

fYear

1998

fDate

7-12 June 1998

Firstpage

1087

Abstract

We have developed a new package for millimeter wave systems. This package employs a feed-through, which utilizes an electromagnetic coupling structure. The chosen electromagnetic coupling structure for the package consists of microstrip line/slot/microstrip line and has a low insertion loss. The insertion loss at the electromagnetic coupling part is estimated to be about 0.3 dB at 60 GHz when the structure is made from conventional alumina material. The package is produced by means of ordinary lamination technology which involves tape casting, printing, laminating and co-firing. High performance is compatible with low cost in this package, and it is suitable for new and big markets utilizing millimeter wave frequencies.

Keywords

casting; laminates; losses; microstrip lines; millimetre wave circuits; packaging; printing; 0.3 dB; 60 GHz; co-firing; electromagnetic coupling structure; feed-through; insertion loss; lamination technology; microstrip line/slot/microstrip line; millimeter wave systems; package; printing; tape casting; Costs; Electromagnetic coupling; Insertion loss; Lamination; Magnetic losses; Microstrip; Millimeter wave technology; Packaging; Printing; Tape casting;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1998 IEEE MTT-S International

Conference_Location

Baltimore, MD, USA

ISSN

0149-645X

Print_ISBN

0-7803-4471-5

Type

conf

DOI

10.1109/MWSYM.1998.705182

Filename

705182