High Accuracy Disbond Thickness Estimation Scheme Employing Multiple-Frequency Near-Field Microwave Measurements

Author

Abou-Khousa, M.A. ; Zoughi, R.

Author_Institution

Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO

fYear

2006

fDate

24-27 April 2006

Firstpage

1967

Lastpage

1970

Abstract

Microwave nondestructive evaluation (NDE) techniques have shown great potential for disbond detection in multi-layer dielectric structures. However, a quantitative disbond thickness estimation scheme has not been introduced yet. In this paper, we propose a maximum-likelihood (ML) disbond thickness estimation scheme utilizing multiple independent measurements obtained at different frequencies. By simulations and experiments, we show that the proposed scheme produces highly accurate disbond thickness estimates

Keywords

maximum likelihood estimation; microwave measurement; nondestructive testing; disbond thickness estimation; maximum likelihood estimation; multiple frequency near field microwave measurements; nondestructive evaluation; Dielectric substrates; Frequency estimation; Frequency measurement; Maximum likelihood detection; Maximum likelihood estimation; Microwave measurements; Microwave theory and techniques; Rectangular waveguides; Reflection; Thickness measurement; Disbond thickness; maximum likelihood (ML); multiple frequency measurements; nondestructive evaluation (NDE;

fLanguage

English

Publisher

ieee

Conference_Titel

Instrumentation and Measurement Technology Conference, 2006. IMTC 2006. Proceedings of the IEEE

Conference_Location

Sorrento

ISSN

1091-5281

Print_ISBN

0-7803-9359-7

Electronic_ISBN

1091-5281

Type

conf

DOI

10.1109/IMTC.2006.328387

Filename

4124697