• DocumentCode
    1887332
  • Title

    Experimental characterization of adhesion between micro-size polymer particles and silicon substrates

  • Author

    Ding, Weiqiang ; Zhang, Huan ; Cetinkaya, Cetin

  • Author_Institution
    Dept. of Mech. & Aeronaut. Eng., Clarkson Univ., Potsdam, NY
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    920
  • Lastpage
    924
  • Abstract
    Understanding the adhesion between a micro/nano-size particle and a substrate is of both scientific and technological interest. Recently we developed a rolling resistance moment based particle adhesion characterization technique. The particle-substrate adhesion was deduced from the response of the adhered particle to a lateral pushing force. With a custom-made nanomanipulator, lateral pushing tests on microsize polymer spheres were performed in the vacuum chamber of a scanning electron microscope and also in the ambient environment. An increasing lateral force was applied to the micro-particle, and the displacement of the particle in response to the lateral force was recorded. From the force-displacement relationship, the work of adhesion between the particle and the substrate was obtained. Experimental results were compared with the available data, and good agreement between the theoretical predictions and the experimental values was found.
  • Keywords
    adhesion; mechanical contact; nanoparticles; particle size; polymers; rolling friction; scanning electron microscopes; silicon; substrates; Si; custom-made nanomanipulator; force-displacement relationship; lateral pushing force; micro-size polymer particles; nano-size particle; particle adhesion characterization technique; particle-substrate adhesion; rolling resistance moment; scanning electron microscope; silicon substrates; Adhesives; Atomic force microscopy; Force measurement; Immune system; Nanobioscience; Particle measurements; Polymers; Silicon; Substrates; Surface resistance; AFM; adhesion; nanomanipulation; nanoparticle;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544365
  • Filename
    4544365