DocumentCode
1887332
Title
Experimental characterization of adhesion between micro-size polymer particles and silicon substrates
Author
Ding, Weiqiang ; Zhang, Huan ; Cetinkaya, Cetin
Author_Institution
Dept. of Mech. & Aeronaut. Eng., Clarkson Univ., Potsdam, NY
fYear
2008
fDate
28-31 May 2008
Firstpage
920
Lastpage
924
Abstract
Understanding the adhesion between a micro/nano-size particle and a substrate is of both scientific and technological interest. Recently we developed a rolling resistance moment based particle adhesion characterization technique. The particle-substrate adhesion was deduced from the response of the adhered particle to a lateral pushing force. With a custom-made nanomanipulator, lateral pushing tests on microsize polymer spheres were performed in the vacuum chamber of a scanning electron microscope and also in the ambient environment. An increasing lateral force was applied to the micro-particle, and the displacement of the particle in response to the lateral force was recorded. From the force-displacement relationship, the work of adhesion between the particle and the substrate was obtained. Experimental results were compared with the available data, and good agreement between the theoretical predictions and the experimental values was found.
Keywords
adhesion; mechanical contact; nanoparticles; particle size; polymers; rolling friction; scanning electron microscopes; silicon; substrates; Si; custom-made nanomanipulator; force-displacement relationship; lateral pushing force; micro-size polymer particles; nano-size particle; particle adhesion characterization technique; particle-substrate adhesion; rolling resistance moment; scanning electron microscope; silicon substrates; Adhesives; Atomic force microscopy; Force measurement; Immune system; Nanobioscience; Particle measurements; Polymers; Silicon; Substrates; Surface resistance; AFM; adhesion; nanomanipulation; nanoparticle;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location
Orlando, FL
ISSN
1087-9870
Print_ISBN
978-1-4244-1700-1
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2008.4544365
Filename
4544365
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