Title :
Avoiding cross talk and feed back effects in packaging coplanar millimeter-wave circuits
Author :
Krems, T. ; Tessmann, A. ; Haydl, W.H. ; Schmelz, C. ; Heide, P.
Author_Institution :
Fraunhofer-Inst. for Appl. Solid State Phys., Freiburg, Germany
Abstract :
The impact of the packaging configuration on cross talk and feed back effects caused by parasitic substrate modes is investigated for coplanar millimeter-wave circuits. It is demonstrated theoretically and by means of several circuit examples that both the mounting configuration and the thickness of the semiconductor substrate of coplanar MIMICs have to be chosen appropriately, in order to avoid circuit degradation or even failure.
Keywords :
MIMIC; circuit feedback; crosstalk; flip-chip devices; integrated circuit packaging; EHF; MM-wave ICs; coplanar MIMICs; coplanar millimeter-wave circuits; crosstalk effects; dielectric carrier; feedback effects; metal package surface; mounting configuration; packaging configuration; parasitic substrate modes; semiconductor substrate thickness; Circuit stability; Conductors; Coplanar transmission lines; Degradation; Feeds; Gallium arsenide; MMICs; Millimeter wave circuits; Semiconductor device packaging; Substrates;
Conference_Titel :
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4471-5
DOI :
10.1109/MWSYM.1998.705183
