Title :
The thermal benefits of diamond enhanced plastic packages for microwave applications
Author :
Gomes-Casseres, M.
Author_Institution :
Lockheed Martin Co., Sanders Associates Inc., Nashua, NH, USA
Abstract :
The superior material properties of diamond combined with the economics of plastic packaging provide the ultimate thermal management solution. A GaAs power amplifier dissipating 20 W has been demonstrated in a diamond enhanced plastic package. In addition, a dramatic improvement in the electrical performance of a coplanar flip chip MMIC in plastic has been achieved.
Keywords :
MMIC; MMIC power amplifiers; diamond; flip-chip devices; integrated circuit packaging; plastic packaging; 20 W; GaAs; GaAs power amplifier; coplanar flip chip MMIC; diamond enhanced plastic packages; material properties; microwave applications; thermal benefits; thermal management; Assembly; Dielectric substrates; Flip chip; Gallium arsenide; Lead; MMICs; PHEMTs; Plastic integrated circuit packaging; Plastic packaging; Power amplifiers;
Conference_Titel :
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4471-5
DOI :
10.1109/MWSYM.1998.705185
