Title :
Development of millimeter wave multi-layer organic based MCM technology
Author :
Pham, A. ; Sutono, A. ; Laskar, J. ; Krishnamurthy, V. ; Cole, H.S. ; Sitnik-Nieters, T.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We present the design and development of multi-layer organic based MCM´s for use at millimeter wave frequencies. In this technology, we utilize a multi-layer interconnect using a vertical stacked via process. We experimentally develop and analyze an equivalent circuit model for this multi-layer interconnect to millimeter wave frequencies. We demonstrate that this vertical interconnect has ultra low parasitics and can be used to realize high performance modules at millimeter wave frequencies.
Keywords :
equivalent circuits; integrated circuit interconnections; millimetre wave integrated circuits; multichip modules; EHF; equivalent circuit model; high performance modules; millimeter wave MCM; multi-layer interconnect; multi-layer organic based MCM technology; ultra low parasitics; vertical stacked via process; Ceramics; Coplanar transmission lines; Dielectric films; Frequency; Integrated circuit interconnections; Microstrip; Millimeter wave technology; Packaging; Space technology; Wire;
Conference_Titel :
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4471-5
DOI :
10.1109/MWSYM.1998.705186
