Development of millimeter wave multi-layer organic based MCM technology

Author

Pham, A. ; Sutono, A. ; Laskar, J. ; Krishnamurthy, V. ; Cole, H.S. ; Sitnik-Nieters, T.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

2

fYear

1998

fDate

7-12 June 1998

Firstpage

1103

Abstract

We present the design and development of multi-layer organic based MCM´s for use at millimeter wave frequencies. In this technology, we utilize a multi-layer interconnect using a vertical stacked via process. We experimentally develop and analyze an equivalent circuit model for this multi-layer interconnect to millimeter wave frequencies. We demonstrate that this vertical interconnect has ultra low parasitics and can be used to realize high performance modules at millimeter wave frequencies.

Keywords

equivalent circuits; integrated circuit interconnections; millimetre wave integrated circuits; multichip modules; EHF; equivalent circuit model; high performance modules; millimeter wave MCM; multi-layer interconnect; multi-layer organic based MCM technology; ultra low parasitics; vertical stacked via process; Ceramics; Coplanar transmission lines; Dielectric films; Frequency; Integrated circuit interconnections; Microstrip; Millimeter wave technology; Packaging; Space technology; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1998 IEEE MTT-S International

Conference_Location

Baltimore, MD, USA

ISSN

0149-645X

Print_ISBN

0-7803-4471-5

Type

conf

DOI

10.1109/MWSYM.1998.705186

Filename

705186