• DocumentCode
    1887944
  • Title

    Thermal time constants in SOI-MOSFETs

  • Author

    Berger, M. ; Burbach, G.

  • Author_Institution
    Dept. of Electron Devices & Circuits, Duisburg Univ., Germany
  • fYear
    1991
  • fDate
    1-3 Oct 1991
  • Firstpage
    24
  • Lastpage
    25
  • Abstract
    The authors present detailed theoretical considerations and a first-order analytical model for the dynamical behavior of self heating in SOIMOS (silicon-on-insulator metal oxide semiconductor). They show the results of the simulated spreading of heat when switching a SOIMOS in the on-state. At least four different time constants can be detected: spreading vertically through the channel region within about 100 ps; passing gate oxide and heating the polygate within 10 ns; heating up S/D-regions and buried oxide within 1 μs; and at about 1 μs heat energy reaches the substrate. The effects showing temperature rise vs. time in the channel and at backside interface are summarized. It is concluded that, in pulsed measurements of SOIMOS output characteristics, a pulse length of 10 ns will already produce an elevated temperature on the order of 10% of the steady-state value
  • Keywords
    insulated gate field effect transistors; semiconductor device models; semiconductor-insulator boundaries; temperature distribution; SOI MOSFET; SOIMOS; backside interface; dynamical behavior; first-order analytical model; heat spreading; on-state switching; self heating; temperature rise; thermal time constants; Analytical models; Circuits and systems; Electron devices; Heating; Integrated circuit interconnections; Microelectronics; Pulse measurements; Steady-state; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1991. Proceedings, 1991., IEEE International
  • Conference_Location
    Vail Valley, CO
  • Print_ISBN
    0-7803-0184-6
  • Type

    conf

  • DOI
    10.1109/SOI.1991.162838
  • Filename
    162838