• DocumentCode
    1888104
  • Title

    Effect of rack modeling detail on the numerical results of a data center test cell

  • Author

    Zhang, Xuanhang Simon ; VanGilder, James W. ; Iyengar, Madhusudan ; Schmidt, Roger R.

  • Author_Institution
    American Power Conversion Corp., Billerica, MA
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    1183
  • Lastpage
    1190
  • Abstract
    This paper is a continuation of the study (Iyengar et al., 2007) that describes the comparison of numerically-predicted and experimentally- measured temperature distributions in a small data center test cell. The data center cell has a floor area of 900 ft2 and comprises one rack, one air-conditioning unit, and perforated tiles. The Computational Fluid Dynamics (CFD) results in study (Iyengar et al., 2007) seem to over-pronounce the hot and cold spots and under-predict the mixing between the hot and cold air streams relative to measurements. One of the possible reasons for the disagreement was believed to be the simplified representation of the server rack in the CFD model. This study investigates the effect of server rack model detail on the prediction of temperature distribution within the data center test cell. It is found that insufficient rack-modeling detail is not a likely cause of the poor agreement between experiment and prediction. However, it is demonstrated that rack modeling detail can significantly impact predictions in certain applications.
  • Keywords
    computational fluid dynamics; computer centres; heat transfer; temperature distribution; CFD model; air-conditioning unit; cold air stream; computational fluid dynamics; data center test cell; hot air stream; perforated tiles; rack modeling detail; raised floor; server rack model; temperature distributions; Air conditioning; Computational fluid dynamics; Numerical models; Power conversion; Power system modeling; Predictive models; System testing; Temperature distribution; Temperature measurement; Tiles; CFD; Data Center; Leakage; Numerical Modeling; Rack Modeling; Raised Floor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544395
  • Filename
    4544395