• DocumentCode
    1888137
  • Title

    Enhanced cooling in a sealed cabinet using an evaporating-condensing dielectric mist

  • Author

    Bahadur, Vaibhav ; Hodes, Marc ; Lyons, Alan ; Krishnan, Shankar ; Garimella, Suresh V.

  • Author_Institution
    Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    1191
  • Lastpage
    1198
  • Abstract
    Many factors, such as acoustic noise limits and fan reliability considerations, limit the heat dissipation capacity of air-cooled cabinets housing telecommunications or computing hardware. The present work examines the potential of enhanced cooling in a sealed telecommunications cabinet using an evaporating- condensing dielectric mist introduced upstream of heat sinks attached to high-power components in a circuit pack, or at the inlet to the circuit packs. The conceptualized system is of a two-component (air and dielectric fluid) and two-phase nature, wherein droplets of mist are dispersed within the air circulating through a sealed cabinet. The evaporated mist is condensed at the outlet of the circuit packs in a cabinet and recycled back to their inlets. First-order models of the mist flow through a heat sink are developed to estimate its influence on flow and heat transfer. The optimum droplet diameter and the optimum mist concentration are obtained from these models for representative conditions. Moreover, the models are used to obtain a first-order estimate of the heat dissipation capacity and the pressure drop required for sustaining the mist flow. The results show that the proposed mist cooling approach offers significant promise for providing high-flux heat removal solutions for sealed cabinets in telecommunications central offices and data centers.
  • Keywords
    cooling; dielectric liquids; drops; heat sinks; telecommunication equipment; data centers; droplets; enhanced cooling; evaporating-condensing dielectric mist; heat sinks; heat transfer; high-flux heat removal; sealed telecommunication cabinet; Acoustic noise; Central office; Circuits; Cooling; Dielectrics; Heat sinks; Heat transfer; Mechanical engineering; Spraying; Telecommunication computing; central office; data center; droplet; evaporation; heat transfer; mist cooling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544396
  • Filename
    4544396