DocumentCode
1888137
Title
Enhanced cooling in a sealed cabinet using an evaporating-condensing dielectric mist
Author
Bahadur, Vaibhav ; Hodes, Marc ; Lyons, Alan ; Krishnan, Shankar ; Garimella, Suresh V.
Author_Institution
Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN
fYear
2008
fDate
28-31 May 2008
Firstpage
1191
Lastpage
1198
Abstract
Many factors, such as acoustic noise limits and fan reliability considerations, limit the heat dissipation capacity of air-cooled cabinets housing telecommunications or computing hardware. The present work examines the potential of enhanced cooling in a sealed telecommunications cabinet using an evaporating- condensing dielectric mist introduced upstream of heat sinks attached to high-power components in a circuit pack, or at the inlet to the circuit packs. The conceptualized system is of a two-component (air and dielectric fluid) and two-phase nature, wherein droplets of mist are dispersed within the air circulating through a sealed cabinet. The evaporated mist is condensed at the outlet of the circuit packs in a cabinet and recycled back to their inlets. First-order models of the mist flow through a heat sink are developed to estimate its influence on flow and heat transfer. The optimum droplet diameter and the optimum mist concentration are obtained from these models for representative conditions. Moreover, the models are used to obtain a first-order estimate of the heat dissipation capacity and the pressure drop required for sustaining the mist flow. The results show that the proposed mist cooling approach offers significant promise for providing high-flux heat removal solutions for sealed cabinets in telecommunications central offices and data centers.
Keywords
cooling; dielectric liquids; drops; heat sinks; telecommunication equipment; data centers; droplets; enhanced cooling; evaporating-condensing dielectric mist; heat sinks; heat transfer; high-flux heat removal; sealed telecommunication cabinet; Acoustic noise; Central office; Circuits; Cooling; Dielectrics; Heat sinks; Heat transfer; Mechanical engineering; Spraying; Telecommunication computing; central office; data center; droplet; evaporation; heat transfer; mist cooling;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
Conference_Location
Orlando, FL
ISSN
1087-9870
Print_ISBN
978-1-4244-1700-1
Electronic_ISBN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2008.4544396
Filename
4544396
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