Title :
A 3-D Camera With Adaptable Background Light Suppression Using Pixel-Binning and Super-Resolution
Author :
Jihyun Cho ; Jaehyuk Choi ; Seong-Jin Kim ; Seokjun Park ; Jungsoon Shin ; Kim, J.D.K. ; Euisik Yoon
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
This paper presents a CMOS time-of-flight (TOF) 3-D camera employing a column-level background light (BGL) suppression scheme for high-resolution outdoor imaging. The use of the column-level approach minimizes a pixel size for high-density pixel arrays. Pixel-binning and super-resolution can be adaptably applied for an optimal BGL suppression at given spatiotemporal resolutions. A prototype sensor has been fabricated by using 0.11 μm CMOS processes. The sensor achieved a fill factor of 24% in a pixel pitch of 5.9 μm which is the smallest among all the reported TOF cameras up to date. Measurement results showed the temporal noise of 1.47 cm-rms with a 100 ms integration time at a demodulation frequency of 12.5 MHz using a white target at 1 m distance. The non-linearity was measured as 1% over the range of 0.75 m ~ 4 m. The BGL suppression over 100 klx was achieved from indoor and outdoor experiments, while the BGL-induced offset was maintained less than 2.6 cm under 0 ~ 100 klx.
Keywords :
CMOS image sensors; demodulation; image resolution; integrated circuit noise; sensor arrays; CMOS time-of-flight 3D camera; TOF; column-level approach; column-level background light suppression scheme; distance 0.75 m to 4 m; frequency 12.5 MHz; high-density pixel array; high-resolution outdoor imaging; optimal BGL suppression; pixel size minimization; pixel-binning; size 0.11 mum; spatiotemporal resolution; super-resolution; time 100 ms; Cameras; Delays; Demodulation; Photoconductivity; Spatial resolution; 3-D camera; Ambient light suppression; CMOS image sensor; background light suppression; demodulation pixel; pinned photodiode; pixel binning; superresolution; time-of-flight;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2014.2340377