Title :
An advanced wet cleaning system for process integration
Author :
Tsugane, Ken ; Tomioka, Hideki ; Shinbara, Kaoru ; Izumi, Akira
Author_Institution :
Device Dev. Center, Hitachi Ltd., Tokyo, Japan
Abstract :
We developed a single wafer wet cleaning system for cluster tools available to φ 200 mm production-line, and clarified the system´s advantages in terms of its ability to remove particles, suppress native oxide growth and adsorption of organic matter. Moreover, we showed that there were no water marks on the wafer treated in this system. Integration of the system and thermal processing chambers avoids exposure to air between each process and enable us to produce highly reliable and high quality devices
Keywords :
cluster tools; semiconductor technology; surface cleaning; 200 mm; adsorption of organic matter; advanced wet cleaning system; cluster tools; high quality devices; highly reliable devices; native oxide growth suppression; particles removal; process integration; production-line; single wafer wet cleaning system; thermal processing chambers; Capacitors; Cleaning; Contamination; Manufacturing processes; Moisture; Oxidation; Semiconductor films; Semiconductor thin films; Spraying; Thin film devices;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3752-2
DOI :
10.1109/ISSM.1997.664495
