DocumentCode
1888267
Title
Reliability and packaging issues in optoelectronics
Author
Fukuda, Mitsuo
Author_Institution
Photonic Bus. Group, NTT Electron. Corp., Tokyo, Japan
fYear
2002
fDate
2002
Firstpage
359
Lastpage
362
Abstract
Reliability and packaging issues are discussed for InGaAsP/InP laser diodes and photodiodes used in current optical fiber transmission systems such as DWDM, SONET/SDH, and data communications.
Keywords
III-V semiconductors; gallium arsenide; gallium compounds; indium compounds; optical communication equipment; photodiodes; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; DWDM systems; InGaAsP-InP; InGaAsP/InP laser diodes; InGaAsP/InP photodiodes; SONET/SDH; optical fiber transmission systems; optoelectronic components; packaging issues; reliability issues; Diode lasers; Frequency; Optical modulation; Optical receivers; Optical transmitters; Packaging; Photodiodes; Strontium; Transceivers; Transponders;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials Conference, 2002. IPRM. 14th
ISSN
1092-8669
Print_ISBN
0-7803-7320-0
Type
conf
DOI
10.1109/ICIPRM.2002.1014422
Filename
1014422
Link To Document