The Design of Wafer Defects Marking System Based on Machine Vision

Several studies were carried out to improve the efficiency of wafer test based on machine vision. The configuration and work flow of system were introduced and each segment was described. The edge image of wafer was extracted from the preprocessed image of wafer and least square method was adopted to gain the wafer diameter firstly. Then, the coordinate of the wafer defects was got through coordinate transformation, and the coordinate was transferred to the probe machine. Finally, the wafer with defects was eliminated by the probe machine. Experiments show that the system exhibits good performance.